Wexmar provides CNC machining for semiconductor equipment builders and their subassembly suppliers from our shop in Canastota, New York. As a semiconductor equipment machine shop, we produce the precision hardware found in wafer handling, process tools, gas delivery and metrology systems: manifolds, fittings, shafts, standoffs, lift pins, brackets and frame components. We machine 316L and 304 stainless, aluminum, titanium, copper and engineered plastics such as PEEK, with CMM reports and material traceability on every lot that requires them.
What semiconductor equipment buyers order from a machine shop
A semiconductor tool contains thousands of machined parts, most of them small to mid-size. Typical requirements we quote include:
- Gas and fluid manifolds with intersecting ports and tight port-to-port positions.
- Fittings, adapters and weld-prep ends in 316L stainless.
- Shafts, lift pins and standoffs for wafer handling and chamber mechanisms.
- Brackets, mounting plates and frame components for tool structure and subassemblies.
- Insulators, spacers and wear parts machined from PEEK, Ultem and PTFE.
- Bus bars and electrical hardware in copper for power distribution.
Materials common to semiconductor equipment
316L stainless is the standard for gas and vacuum wetted parts because of its low carbon content and corrosion resistance. 304 stainless serves structural hardware. Aluminum 6061-T6 is widely used for plates, frames and chamber-adjacent parts, frequently with hard anodize applied through qualified outside processors. Titanium appears where low weight and chemical resistance are both needed, and copper C110 is used for electrical and thermal parts. Engineered plastics, including PEEK, Ultem, PTFE and acetal, are chosen for insulating and low-particle wear surfaces. Our materials page covers each grade.
Tolerances, finishes and documentation
Semiconductor equipment drawings emphasize flatness, position and surface condition. Typical callouts include hole positions at ±.001 in., flatness of .001 to .002 in. on sealing and mounting faces, bore and shaft diameters at ±.0005 in., and surface finish of 16 to 32 Ra on sealing surfaces. Burr-free internal port intersections matter on manifolds, and we review deburr access at quote.
Finishes such as hard anodize, electropolish, passivation and plating, along with precision cleaning and cleanroom packaging where specified, are handled through qualified outside processors. Documentation available includes:
- CMM reports from NIST-traceable Brown & Sharpe CMMs.
- Mill material certs with heat-lot traceability.
- First article inspection in AS9102 format or your template.
- Certificate of conformance and outside processor certs.
Our quality system is ISO 9001:2015-aligned, and gage calibration is ISO/IEC 17025-aligned.
Quantity patterns: prototype, build and spares
Semiconductor equipment demand follows tool build schedules. New platform development needs prototype lots of 1 to 10. Production tool builds call for recurring releases of 10 to 500 pieces per part number, often in kits across many part numbers. Field service and spares programs order small lots of replacement parts year-round. Because demand swings with the chip cycle, we quote flexible release schedules and can hold material for repeat part numbers.
How our floor handles CNC machining for semiconductor equipment
Horizontal milling for manifolds and plates
Six horizontal machining centers with pallet changers run 3- and 4-axis horizontal milling. A manifold on a tombstone can have ports drilled from four sides in one setup, which keeps port intersections aligned. See our CNC milling page.
Turning and Swiss
Ten CNC lathes with live tooling and Y-axis produce fittings, shafts and flanged parts complete. Four Maier MLK-32 Swiss machines handle lift pins, standoffs and small fittings to 32 mm diameter, where long slender parts need support close to the cut.
Grinding and inspection
A surface grinder finishes flat sealing faces, a centerless grinder finishes pin diameters, and two CMMs plus an optical comparator verify positions and profiles.
Typical semiconductor equipment parts, materials and tolerances
| Part | Common material | Typical tolerance | Primary process |
|---|---|---|---|
| Gas manifold | 316L | ±.001 in. port position | 4-axis horizontal milling |
| Lift pin | Ti-6Al-4V, PEEK | ±.0005 in. OD | Swiss |
| Mounting plate | 6061-T6 | .001 in. flatness | Horizontal milling, surface grind |
| Weld fitting | 316L | ±.001 in. | Lathe or Swiss |
| Insulator | PEEK, Ultem | ±.002 in. | Lathe or horizontal milling |
| Bus bar | Copper C110 | ±.005 in. | Horizontal milling |
Getting a quote
Send drawings or STEP files, quantities, finish and cleaning requirements, and any supplier quality clauses. You can upload a drawing for an instant estimate, and a human estimator confirms every quote. For semiconductor equipment parts, call (315) 400-2654, Monday through Friday, 7 to 4 Eastern, or email ron@backwell.com.